Boiling Heat Transfer Enhancement by Using Micro-Pin-Finned Surface for Electronics Cooling
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Boiling Heat Transfer Enhancement by Using Micro-Pin-Finned Surface for Electronics Cooling
- 发表刊物：
- Microgravity Science and Technology
- 摘要：
- For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10×10×0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30×60， 30×120 , 50×60 , 50×120 m2 (thickness, t × height, h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux, qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85 oC. The largest value of qmax can reach nearly 148 W/cm2 for micro-pin-finned chips with the fin height of 120 m at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned surfaces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented.
- 合写作者：
- J. J. Wei*, J. F. Zhao, M. Z. Yuan, Y. F. Xue
- 卷号：
- 21
- 是否译文：
- 否
- 发表时间：
- 2009-08-01