一种芯片的沸腾强化换热结构及其制作方法
Release Time:2025-04-30
Hits:
- Title:
- 一种芯片的沸腾强化换热结构及其制作方法
- Disigner of the Invention:
- 魏进家、薛艳芳、方嘉宾、高秀峰、袁敏哲
- Type of Patent:
- Invent
- Application Number:
- ZL 200810236502.9
- Service Invention or Not:
- No
- Application Date:
- 2008-12-26
- Date:
- 2025-04-30
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