Date:

2025-04-30

Title of Paper:

Enhancement of Flow-Jet Combined Boiling Heat Transfer of FC-72 Over Micro-Pin-Finned Surfaces

Journal:

Journal of Enhanced Heat Transfer

Summary:

For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 3060 m2 and 30120 m2 (thickness  height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities Vc (0.5, 1.0, 1.5 m/s) and different jet velocities Vj (0–2 m/s) with two liquid subcooling ∆Tsub (25◦C and 35◦C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux qmax is increased and the wall superheat is decreased greatly. For a given Vc, the heat transfer enhancement is more significant as Vj increases, but the qmax increment decreases as Vc increases. The fin efficiency decreases as Vc or/and Vj increases or the heat flux q increases. The maximum qmax can reach 161 W/cm2 at Vc = 1.5 m/s, Vj = 2 m/s, ∆Tsub = 35◦C for chip PF30-120.

Co-author:

Y. H. Zhang, J. J. Wei*, D. Guo

Volume:

19(6)

Page Number:

483-503

Translation or Not:

No

Date of Publication:

2012-12-10