Date:

2025-04-30

Title of Paper:

Enhanced Flow Boiling Heat Transfer of FC-72 on Micro-Pin-Finned Surfaces

Journal:

Int J Heat Mass Tranfser

Summary:

Abstract
For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over silicon chips. Micro-pin-finns were fabricated on the chip surface using a dry etching technique to enhance boiling heat transfer. Three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35K) were performed respectively. A smooth chip (chip S) and four micro-pin-finned chips having the same fin thickness of 30µm and different fin heights of 60µm (chip PF30-60) and 120µm (chip PF30-120) respectively, were tested. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared to a smooth surface, and the critical heat flux increases in the order of chip S, PF30-60 and PF30-120. For a lower ratio of fin height to fin pitch and/or higher fluid velocity, the nucleate boiling curves for the micro-pin-finned surfaces is affected by fluid velocity. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat and the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85 ℃. The CHF values for all surfaces increase with fluid velocity and subcooling. The maximum CHF can reach nearly 150 W/cm2 for chip PF30-120 at the fluid velocity of 2 m/s and the liquid subcooling of 35 K.
Keywords: Flow boiling heat transfer; Electronic cooling; high heat flux; Micro-pin-fin; FC-72

Co-author:

A. X. Ma, J. J. Wei*, M. Z. Yuan, J. B. Fang

Volume:

52(13-14)

Page Number:

2925-2931

Translation or Not:

No

Date of Publication:

2009-03-30