CN

王久洪

研究员       Supervisor of Master's Candidates

  • E-Mail:
  • Education Level:With Certificate of Graduation for Doctorate Study

Patents

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用于寒冷环境水压测量的抗结冻过载充油式芯体封装结构

Release Time:2025-04-30
Hits:
Title:
用于寒冷环境水压测量的抗结冻过载充油式芯体封装结构
Disigner of the Invention:
王久洪,王圣旗, 韩香广, 乔智霞, 赵立波, 皇咪咪, 高漪, 尚钰杰
Type of Patent:
Invent
Application Number:
2024107096850
Service Invention or Not:
No
Application Date:
2024-06-03
Date:
2025-04-30