超声传感器压电晶体制备与薄膜封装工艺研究
Release Time:2025-04-30
Hits:
- Project Name:
- 超声传感器压电晶体制备与薄膜封装工艺研究
- Status:
- 进行中
- Classification of Project:
- Horizontal Project
- Project Source:
- School-enterprise cooperation
- Project Number:
- -
- Date of Project Approval:
- 2018-01-01
- Date of Project Completion:
- 2021-03-01
- Subsidy Amount(Wan Yuan):
- 10.0
- Date:
- 2025-04-30
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