Date:

2025-10-16

Title of Paper:

Numerical study on transient flow boiling performance of the microchannels with grooved pin fins

Journal:

ASME J. Heat Mass Transfer

Summary:

The microchannel flow boiling cooling technology has excellent developmental potential in
high heat flux electronic devices. Saturated flow boiling in a microchannel with V-shaped
grooved pin fins is simulated using the volume of fluid (VOF) model. The working coolant is
Novec649. The depth-to-width ratio b of a single groove isset as 0, 1, and 2,respectively. The
results show that with the increase of b, the maximal average temperature of heated walls
decreases, and at q ¼ 100, 300, and 500 kW m 2
, the average temperature at b ¼ 2 declined
1.5, 5.3, and 9.3K, respectively, compared with that at b ¼ 0. The corresponding pressure
drops are decreased by 24%, 25%, and 24%, respectively. The corresponding heat transfer
factor remarkably increases 14–40%. Moreover, the model with b ¼ 1 has the superior heat
transfer coefficient while the model with b ¼ 2 has the best comprehensive heat transfer
factor as a whole. [DOI: 10.1115/1.4067164]

Co-author:

Shuang Wang, Zhiwu Ke, Wei Zheng, Mei Lin, Qiuwang Wang

Volume:

147（4）

Page Number:

041602

Translation or Not:

No

Date of Publication:

2025-04-01