Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink
Release Time:2025-04-30
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- Date:
- 2025-04-30
- Title of Paper:
- Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink
- Journal:
- Diamond and Realted Materials
- Co-author:
- J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang
- Volume:
- 143
- Page Number:
- 110887
- Translation or Not:
- No
- Date of Publication:
- 2024-03-25