Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation
- Journal:
- Journal of Materials Engieering and Performance
- Co-author:
- NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang
- Translation or Not:
- No
- Date of Publication:
- 2024-01-07