Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers
- Journal:
- Surface Topography-Metrology and Properties
- Co-author:
- YF Qu, HY Bai, WB Hu*, Y Yuan, SL Wu, HX Wang, HQ Fan
- Volume:
- 11(2)
- Page Number:
- 025013
- Translation or Not:
- No
- Date of Publication:
- 2023-05-28