覃华松

副教授

Supervisor of Master's Candidates

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Manipulating interfacial thermal conduction of 2D Janus heterostructure via a thermal-mechanical coupling

Release Time:2025-04-30
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Date:
2025-04-30
Title of Paper:
Manipulating interfacial thermal conduction of 2D Janus heterostructure via a thermal-mechanical coupling
Journal:
Advanced Functional Materials
Co-author:
Kai Ren; Huasong Qin*; Huichao Liu; Yan Chen; Xiangjun Liu; and Gang Zhang*
Volume:
32
Page Number:
2110846
Translation or Not:
No
Date of Publication:
2022-01-24