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黄平

  • Personal Information
  • E-Mail:
  • Professional Title: 教授
  • Status: Employed
  • Alma Mater: 西安交通大学
  • Have Any Overseas Experience: No
  • Foreign Personnel or Not: No

Patents

Current position: Home > Research > Patents

一种层界面结构可控的CuNb/Cu纳米合金薄膜制备方法

Release Time:2025-04-30
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Title:
一种层界面结构可控的CuNb/Cu纳米合金薄膜制备方法
Disigner of the Invention:
王飞,顾超,黄平
Type of Patent:
Invent
Application Number:
ZL 2015 1 0044598.9
Service Invention or Not:
No
Application Date:
2018-01-19
Date:
2025-04-30