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可调控裂纹大小和电导率的模拟应力腐蚀裂纹制备方法

Release Time:2025-04-30
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Title:
可调控裂纹大小和电导率的模拟应力腐蚀裂纹制备方法
Disigner of the Invention:
陈振茂,蔡文路,解社娟,裴翠祥,田淑侠,陈洪恩
Type of Patent:
Invent
Application Number:
201610161231.X
Service Invention or Not:
No
Application Date:
2016-03-21
Date:
2025-04-30