Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
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发布时间:2025-04-30
发布时间:2025-04-30
论文名称:Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
发表刊物:2021 IEEE 4th International Conference on Electronic Information and Communication Technology (ICEICT)
合写作者:Y. Liu and J. Chen
是否译文:否
发表时间:2021-08-19

