Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
Release Time:2025-04-30
Hits:
- Date:
- 2025-04-30
- Title of Paper:
- Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
- Journal:
- 2021 IEEE 4th International Conference on Electronic Information and Communication Technology (ICEICT)
- Co-author:
- Y. Liu and J. Chen
- Translation or Not:
- No
- Date of Publication:
- 2021-08-19